Our technical capabilities for PCB manufacturing
For decades our company is specialised in PCB manufacturing in small volume and express delivery. Our factory has the best equipment and technology to build quality PCBs. Besides, common boards, we are also able, and happy, to support you for more complex boards.
There is no faster quotation then an on-line system. With PCBprototype.com, you are able to configure your PCB on-line, many options are available and you get an instant price and delivery time for your newly designed PCB. Up-load your gerber files, click the order button and we will start working on your latest project.
Other PCBs on demand
On this page, you will find our capabilities for standard FR4 PCBs. Our equipment & knowledge allow us to manufacture other types of PCBs not available to order on-line. So, besides the types of PCB available on-line, we are also able to produce:
- Rigid PCB: 16 to 32 layers
- Wider range of material & copper thickness upon request
- HDI boards with laser drills, buried and blind vias
- FPC, flexible from 6 to 10 layers
- Flex-rigid till 12 layers, semi-flex
- PCB with embedded capacitors & resistors
- Technical substrates: Arlon, Rogers, FR408HR, etc
Please contact us, if you need more information.
| What | Standard Capabilities | On RFQ demand |
|---|---|---|
| Layer quantity | 1 to 32 layers | up to 42 layers |
| Material thickness (1 and 2 layers) | 0.2mm to 5mm | < 0.2mm or > 5.0mm |
| Material thickness (for multilayers) | 0.35mm to 5.0mm | < 0.35mm or > 5.0mm |
| Material thickness tolerance | For < 1.0mm: +/- 0.1mm, for >1.0mm: +/-10% | |
| Outer Copper thickness | 17, 35, 70, 105, 140, 175µm | 210 to 350µm |
| Inner Copper thickness | 17, 35, 70, 105, 140, 175, 210µm | |
| Base material type | FR4 TG130°C, TG150°C, TG170°C | TG200°C, TG230°C, Rogers, Arlon, Teflon |
| Surface finish | OSP, LF-HASL, imm. gold (ENIG), ENEPIG, Silver, Tin | HASL with lead |
| Immersion tin thickness | 0.8 to 1.5µm | |
| HAL lead free thickness | ≥ 0.4µm | |
| HAL lead thickness | ≥ 0.4µm | |
| ENIG - Immersion gold - nickel thickness | 3 to 5µm | |
| ENIG - Immersion gold - gold thickness | 0.025 to 0.127µm | |
| Electrolytic connectic gold / hard gold | Ni thickness: 3 to 5µm | |
| Electrolytic connectic gold / hard gold | Au thickness: 0.125 to 1.3µm | |
| Connector gold | Yes | |
| Maximum PCB size 1 and 2 layers PCB | 546 x 1198mm | |
| Maximum PCB size for multilayer PCBs | 546 x 1198mm | |
| Minimum unit PCB size | 10 x 10mm | |
| Minimum circuit PCB in routing panels | 10 x 10mm | |
| Minimum PCB width | 5mm | |
| Multi panels (more than one layout per panel) | Yes | |
| Half-open PTH on PCB edge | Yes | |
| Edge plating (outer edge) | Yes | |
| Via-Filling (no copper lid) | Yes | |
| Electric test | Flying probe if< 3sqm or fixture if > 3sqm | |
| Plugging with copper lid (e.g. for via-in-pad) | Yes | |
| Peelable mask | Top, bottom or double sided | |
| Carbon print / smallest pad-to-pad distance | Yes / 0.7mm | |
| Bevelling | Yes | |
| Bevelling angle | 20°, 25°, 30°, 45° | |
| Jump-v-cut | Yes | |
| V-cut depth | +/-0.075mm | |
| Z-axis milling | Yes, tolerance +/-0.2mm | |
| Counter-sink-holes | Yes | |
| Multilayer special stack-up | Yes | |
| Smallest mechanical drill | 0.15mm | RFQ if thickness/aperture > 10:1 |
| Smallest annular ring 35µm | 0.2mm larger than the via | |
| Smallest annular ring 70µm & 105µm | 0.4mm larger than the via | |
| Smallest annular ring 140µm & 210µm | 0.5mm larger than the via | |
| Possible drill diameters | 0.2 to 6.3mm | < 0.2mm |
| Smallest drill distance (drill edge to drill edge) | 0.125mm | |
| Smallest blind via (final diameter) | 0.2mm | 0.15mm |
| Smallest annular ring | 0.1mm larger than the via | |
| Smallest buried via (final diameter) | 0.2mm | 0.15mm |
| Smallest inner routing NPTH | 0.8mm | |
| Smallest radius (inner corners) NPTH | 0.4mm | |
| Smallest inner routing PTH (final diameter) | 0.95mm | |
| Special routing paths with plating (inner) | Yes | |
| Trace & spacing on 18µm | 0.076mm | |
| Trace & spacing on 35µm | 0.076mm | |
| Trace & spacing on 70µm | 0.178mm | |
| Trace & spacing on 105µm | 0.254 mm | |
| Copper clearance to inner routing | 0.20 for inner layers, 0.25mm for outer layers | |
| Copper clearance to board edge (routing) | 0.20 for inner layers, 0.25mm for outer layers | |
| Copper clearance to board edge (v-cut) | 0.45mm | |
| Solder mask colour | Green, white, black, blue, red | |
| Solder mask, smallest web (green, straight) | 0,1mm | |
| Solder mask, smallest web (non-green, straight) | 0.127mm | |
| Solder mask, smallest web (round) | 0.1mm | |
| Solder mask, smallest size around copper | 0.15mm bigger than the copper pad | |
| Solder mask, smallest text lines | 0.21mm | |
| Silk print colour | White, black | Yellow, red |
| Silk screen smallest lines | Width: 0.1mm, height: 0.6mm | |
| Silk screen smallest distance between lines | 0.1mm | |
| Silk screen minimum clearance to copper pads | 0.05mm | |
| Max. offset drill centre to centre of reference | 0.075mm | |
| Finished drill sizes PTH (up to 3mm) | +/-0.075mm | |
| Finished drill sizes PTH (>3mm) | +/-0.075mm | |
| Finished drill sizes NPTH (up to 6mm) | +/-0.05mm | |
| Finished drill sizes NPTH (>6mm) | +/-0.05mm | |
| Outline | +/-0.1mm | |
| Winding | 0.2% to 0.75% | |
| Warping | 0.2% to 0.75% | |
| Base materials RoHS-compliance | Always | |
| Surface finish RoHS-compiance | Always | Unless "HAL lead" is explicitly required |
| IPC-norm | IPC-A-600G - Class 2 or Class 3 | |
| UL-approved base material | Always | |
| DIN EN ISO 9001 certification for PCB | Yes | |
| DIN EN ISO 14001 certification for PCB | Yes | |
| DIN EN ISO 16949 certification for PCB | Yes, PPAP upon request | |
| Production lead time for 1 & 2 layers PCB | From 4WD (< 1sqm) to 11WD (above 10sqm) | Express in 48H |
| Production lead time for 4 & 8 layers PCB | From 6WD (< 1sqm) to 14WD (above 10sqm) | Express in 48H |
| Production lead time for 10 & 14 layers PCB | From 9WD (< 1sqm) to 18WD (above 10sqm) | Express in 120H |
| Production lead time for 16 to 24 layers PCB | From 12WD (< 1sqm) to 24WD (above 10sqm) | Express in 150H |